In theproduction of high-density, miniaturized PCBAs, laser soldering technology isbecoming a core process for solving the challenge of soldering tiny joints dueto its precise energy control capabilities. This technology achieves localized,instantaneous heating through a focused laser beam, precisely melting thesolder material, perfectly meeting the "miniaturization" and"high-density" assembly requirements of modern electronicsmanufacturing.

TechnicalPrinciple: Laser soldering technology utilizes a high-energy-density laserbeam, focused on the target solder joints of the PCBA through an opticalsystem. Unlike the large-area heating of traditional soldering, it employsnon-contact, localized heating, controlling the solder joint heating time tothe millisecond level. Simultaneously, a coaxial air blowing system removesoxides from the soldering area, ensuring effective solder wetting.

QualityAdvantages:

•Heat-affected zone diameter less than 0.3mm, avoiding thermal damage tomicrochips and precision sensors.

•Solder joint diameter can be precisely controlled within 0.1-1.0mm, adapting tothe soldering of ultra-fine pitch components.

•No physical contact avoids PCBA board warping and deformation, improving thesoldering yield of high-density boards.

•Precise and controllable solder usage reduces material waste by 50%, loweringproduction costs.

ApplicationAreas: Widely used in core soldering scenarios for high-precision PCBAs.

•Smartphone RF modules (ultra-fine pitch RF chips)

•Wearable device motherboards (micro sensors and battery contacts)

•Medical device control boards (precision sensors and signal processing chips)

•Aerospace navigation modules (high-density interconnect devices)

AsPCBA integration continues to increase, the demand for soldering micro-pitchand thermally sensitive components is growing. Laser soldering technology isovercoming the limitations of traditional processes through "minimallyinvasive precision." It ensures the soldering reliability of high-densityPCBAs while adapting to the manufacturing needs of miniaturized electronicdevices, providing key technical support for precision PCBA assembly.