Thisupgrade focused specifically on enhancing the collaborative efficiency betweenSMT and DIP processes, with a key emphasis on optimizing two core operationalstages. In the SMT stage, we introduced fully automated, high-speedpick-and-place machines alongside AI-driven visual inspection systems. Thesesystems support the precise placement of miniature components—down to the 01005package size—boosting placement speeds to 12,000 points per hour. With adetection accuracy of 0.02mm, the system can identify defects—such as solderpaste printing deviations and component placement offsets—in real-time. Thiscapability yields a defect recognition rate exceeding 99.5%, therebydrastically reducing both manual inspection costs and error rates.
Concurrently,the DIP stage was upgraded with fully automated component insertion machinesand lead-free wave soldering equipment. Utilizing a dual-wave design, thesystem can precisely adjust soldering parameters based on specific componentcharacteristics, effectively resolving issues such as solder bridging inhigh-density through-hole components. This ensures insertion accuracy remainswithin ±0.1mm and drives the soldering defect rate down to below 0.02%.Furthermore, by establishing seamless data interoperability between the SMT andDIP stages, we have achieved real-time synchronization of production parametersand a fluid transition between processes; this has reduced line changeovertimes by 40%, thereby significantly enhancing our flexible manufacturingcapabilities.
Notably,the upgraded collaborative production system also incorporates digitalmanagement modules, enabling end-to-end traceability—from raw material input tofinished product inspection. This capability allows us to respond rapidly toorders involving small batches and high product variety, ultimately leading toshorter delivery lead times.