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     Cause analysis：Due to the distance between through hole pads and SMD components is less than 5mm, after making wave soldering jigs, appeared tin-conection between pad and pad, caused short circuit; defective rate is 100% .So after wave soldering process needs to add one hand soldering position to do the touch up work, this way increased the labor cost, From the perspective of quality: Because of the through hole pads are close to the SMD components When added the tin to the through hole components pin/touching up, using the soldering-iron let the SMD components drop off, producing solder tip ,tin connection short circuit and other defect phenomena;

Improvement action analysis: Changing from THT   processs to smt reflow process, the specific practices are putting solder paste filled with the tht components hole, putting the plug components insert into the middle of tht components hole, putting the board into the reflow soldering oven. In this way, we do not need to arrange worker to do touch up work, it reduces labor cost; from perspective of quality, the through hole solder reaches more than 90%, it is far beyond the international standard IPC-A-610F and the production first Pass Yield rate is 100%.